Vishay Isolated TrenchFET 2 Type P-Channel Power MOSFET, 2.3 A, 30 V Enhancement, 6-Pin TSOP SI3993CDV-T1-GE3
- RS Stock No.:
- 165-6919
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- SI3993CDV-T1-GE3
- ผู้ผลิต:
- Vishay
มีส่วนลดเมื่อซื้อจำนวนมาก
ดูตัวเลือกการกำหนดราคาในการซื้อปริมาณมากยอดรวมย่อย (1 รีล รีลละ 3000 ชิ้น)*
THB21,792.00
(ไม่รวมภาษีมูลค่าเพิ่ม)
THB23,316.00
(รวมภาษีมูลค่าเพิ่ม)
ส่งฟรีหากซื้อเกิน ฿2,500.00
หมดสต็อกชั่วคราว
- จะส่งได้หลังจากวันที่ 05 กุมภาพันธ์ 2570 ไปอีกประมาณ 7 วันทำการ
ต้องการสินค้าเพิ่มหรือไม่ ระบุจำนวนและคลิก ‘ตรวจสอบวันจัดส่ง’ เพื่อดูข้อมูลเพิ่มเติมเกี่ยวกับสต็อกสินค้าและการจัดส่ง
ชิ้น | ต่อหน่วย | ต่อม้วน* |
|---|---|---|
| 3000 - 3000 | THB7.264 | THB21,792.00 |
| 6000 - 9000 | THB7.046 | THB21,138.00 |
| 12000 + | THB6.834 | THB20,502.00 |
*ตัวบ่งบอกราคา / price indicative
- RS Stock No.:
- 165-6919
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- SI3993CDV-T1-GE3
- ผู้ผลิต:
- Vishay
คุณสมบัติ / Specifications
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
รายละเอียดสินค้า / Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | Vishay | |
| Product Type | Power MOSFET | |
| Channel Type | Type P | |
| Maximum Continuous Drain Current Id | 2.3A | |
| Maximum Drain Source Voltage Vds | 30V | |
| Package Type | TSOP | |
| Series | TrenchFET | |
| Mount Type | Surface | |
| Pin Count | 6 | |
| Maximum Drain Source Resistance Rds | 188mΩ | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Typical Gate Charge Qg @ Vgs | 5.2nC | |
| Maximum Power Dissipation Pd | 1.4W | |
| Maximum Gate Source Voltage Vgs | -20V, +20V | |
| Maximum Operating Temperature | +150°C | |
| Transistor Configuration | Isolated | |
| Height | 1mm | |
| Length | 3.1mm | |
| Width | 1.7mm | |
| Standards/Approvals | No | |
| Number of Elements per Chip | 2 | |
| Automotive Standard | No | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand Vishay | ||
Product Type Power MOSFET | ||
Channel Type Type P | ||
Maximum Continuous Drain Current Id 2.3A | ||
Maximum Drain Source Voltage Vds 30V | ||
Package Type TSOP | ||
Series TrenchFET | ||
Mount Type Surface | ||
Pin Count 6 | ||
Maximum Drain Source Resistance Rds 188mΩ | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Typical Gate Charge Qg @ Vgs 5.2nC | ||
Maximum Power Dissipation Pd 1.4W | ||
Maximum Gate Source Voltage Vgs -20V, +20V | ||
Maximum Operating Temperature +150°C | ||
Transistor Configuration Isolated | ||
Height 1mm | ||
Length 3.1mm | ||
Width 1.7mm | ||
Standards/Approvals No | ||
Number of Elements per Chip 2 | ||
Automotive Standard No | ||
- COO (Country of Origin):
- CN
Vishay TrenchFET Series Power MOSFET, 30V Drain Source Voltage, 2.3A Continuous Drain Current - SI3993CDV-T1-GE3
This power MOSFET is a surface-mount P-channel transistor designed for switching and load-management roles in compact electronic assemblies. It provides an isolated transistor configuration in a low-profile TSOP package and is intended for applications requiring moderate current handling and controlled gate drive within a 30V voltage environment.
Features and Benefits:
• P-channel enhancement mode enables simple high-side switching
• Peak continuous drain current 2.3A supports moderate loads
• Low Rds(on) at 188mΩ reduces conduction losses
• Typical gate charge 5.2nC enables fast gate transitions
• Maximum power dissipation 1.4W manages thermal load in small boards
• Six-pin surface-mount package allows compact PCB placement
• Peak continuous drain current 2.3A supports moderate loads
• Low Rds(on) at 188mΩ reduces conduction losses
• Typical gate charge 5.2nC enables fast gate transitions
• Maximum power dissipation 1.4W manages thermal load in small boards
• Six-pin surface-mount package allows compact PCB placement
Applications
• Suitable for battery-powered high-side switching circuits
• Ideal for DC load disconnect and reverse-current blocking
• Used with power-management modules in consumer devices
• Can be used for level-shifted gate control in compact assemblies
• Ideal for DC load disconnect and reverse-current blocking
• Used with power-management modules in consumer devices
• Can be used for level-shifted gate control in compact assemblies
What gate drive constraints should I consider?
The device accepts up to ±20V between gate and source, so gate-drive circuitry must keep Vgs within that range to prevent gate stress.
How tolerant is it to temperature extremes during operation?
It operates across a wide temperature span from -55°C to 150°C, permitting use in environments with severe thermal variation.
How many transistor elements does the die include and what is the package pin count?
The chip integrates two elements and the package presents six pins for board connections.
What is the maximum drain-source voltage and how does that influence circuit design?
The MOSFET is rated to 30V between drain and source, so it should be used where supply rails and transient conditions remain below that threshold.
ลิงก์ที่เกี่ยวข้อง
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