Transcend M.2 2 TB Internal SSD
- RS Stock No.:
- 683-006
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- TS2TMTE760T
- ผู้ผลิต:
- Transcend
N
ยอดรวมย่อย (1 ชิ้น)*
THB65,039.04
(ไม่รวมภาษีมูลค่าเพิ่ม)
THB69,591.77
(รวมภาษีมูลค่าเพิ่ม)
ส่งฟรีหากซื้อเกิน ฿2,500.00
มีในสต็อก
- 2 ชิ้นพร้อมจัดส่งจากคลังสินค้าต่างประเทศ
ต้องการสินค้าเพิ่มหรือไม่ ระบุจำนวนและคลิก ‘ตรวจสอบวันจัดส่ง’ เพื่อดูข้อมูลเพิ่มเติมเกี่ยวกับสต็อกสินค้าและการจัดส่ง
ชิ้น | ต่อหน่วย |
|---|---|
| 1 + | THB65,039.04 |
*ตัวบ่งบอกราคา / price indicative
- RS Stock No.:
- 683-006
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- TS2TMTE760T
- ผู้ผลิต:
- Transcend
คุณสมบัติ / Specifications
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
รายละเอียดสินค้า / Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | Transcend | |
| Memory Size | 2TB | |
| Sub Type | SSD | |
| Product Type | SSD | |
| Internal/External | Internal | |
| Form Factor | M.2 | |
| Industrial Grade | Yes | |
| NAND Type | 3D | |
| Interface Type | NVMe PCIe Gen 4 x4 | |
| Encryption Level | 256 Bit AES Encryption | |
| Minimum Operating Temperature | -20°C | |
| Maximum Operating Temperature | 75°C | |
| Width | 22mm | |
| Length | 80mm | |
| Standards/Approvals | UKCA | |
| Height | 2.23mm | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand Transcend | ||
Memory Size 2TB | ||
Sub Type SSD | ||
Product Type SSD | ||
Internal/External Internal | ||
Form Factor M.2 | ||
Industrial Grade Yes | ||
NAND Type 3D | ||
Interface Type NVMe PCIe Gen 4 x4 | ||
Encryption Level 256 Bit AES Encryption | ||
Minimum Operating Temperature -20°C | ||
Maximum Operating Temperature 75°C | ||
Width 22mm | ||
Length 80mm | ||
Standards/Approvals UKCA | ||
Height 2.23mm | ||
- COO (Country of Origin):
- TW
Transcend SSD, 2TB Memory size, NVMe PCIe Gen 4 x4 Interface Type - TS2TMTE760T
This SSD is an internal storage device designed for high-performance NVMe applications in industrial settings. It connects via a PCIe Gen4 x4 Interface in an M.2 form factor and is intended for use where compact, high-capacity flash storage is required under demanding environmental conditions.
Features and Benefits:
• 2TB capacity enables large dataset and image storage
• NVMe PCIe Gen4 x4 provides high-throughput transfer rates
• 3D NAND offers increased storage density for longevity
• 256-bit AES encryption secures stored data at rest
• Industrial-grade design tolerates extreme operational stress
• Operating range from -20°C to 75°C supports harsh environments
• NVMe PCIe Gen4 x4 provides high-throughput transfer rates
• 3D NAND offers increased storage density for longevity
• 256-bit AES encryption secures stored data at rest
• Industrial-grade design tolerates extreme operational stress
• Operating range from -20°C to 75°C supports harsh environments
Applications
• Suitable for embedded automation controllers requiring local mass storage
• Ideal for data logging in electrical test rigs and instrumentation
• Used with industrial PCs in manufacturing process control
• Can be used for onboard storage in robotics and motion systems
• Suitable for edge computing in remote monitoring installations
• Ideal for data logging in electrical test rigs and instrumentation
• Used with industrial PCs in manufacturing process control
• Can be used for onboard storage in robotics and motion systems
• Suitable for edge computing in remote monitoring installations
What physical footprint does it occupy for board layout planning?
It uses the M.2 2280 footprint with a width of 22mm and a length of 80 mm, enabling Compact placement on compatible carrier boards.
How does it handle elevated junction temperatures during sustained workloads?
The device is rated to operate up to a maximum temperature of 75°C, supporting continuous operation in thermally challenging locations.
Is it suitable for integration into sealed electrical enclosures?
Yes, its industrial grading and temperature tolerance make it appropriate for enclosed equipment where ambient conditions can vary.
Which NAND architecture is employed and what is the impact on endurance?
It uses 3D NAND, which increases cell stacking for higher density and contributes to improved programme/erase endurance profiles compared with Planar NAND.
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