Amphenol Communications Solutions Bergstik Series Vertical Through Hole Pin Header, 2 Contact(s), 2.54 mm Pitch, 1 Row,

รูปภาพประกอบสินค้าเป็นเพียงรูปภาพใกล้เคียงเท่านั้น กรุณาอ่านรายละเอียดสินค้า

ไม่พร้อมจำหน่ายในตอนนี้
ขออภัย เราไม่ทราบว่าสินค้านี้จะกลับมาในสต็อกเมื่อใด
TH- RSPROC&C-PDP-1025
RS Stock No.:
218-0856
หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
77311-818-02LF
ผู้ผลิต:
Amphenol Communications Solutions
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด

Brand

Amphenol Communications Solutions

Series

Bergstik

Product Type

Pin Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

2

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Through Hole

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

2.9mm

Contact Gender

Male

Standards/Approvals

CHINA RoHS, EU RoHS, REACH/SvHC

Mating Pin Length

5.84mm

Voltage

1500 V

COO (Country of Origin):
FR
The Amphenol FCI BergStik 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row. They are available in straight or right angle options, from 2 to 72 positions featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik 2.54mm unshrouded vertical headers in 0.25μm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik product range provides Board-to-Board, Wire to-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices.

Allow dual entry; mating from top or bottom

Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements

Can be used for wire wrapping

Allows cleaning to remove soldering contamination

Duplex plating

Tin-lead plating in press-fit area

Easy pin insertion onto PCB

Retention legs option

High retention force onto PCB