Amphenol ICC 10075025 Series Straight Through Hole PCB Header, 20 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 787-611
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 10075025-G01-20ULF
- ผู้ผลิต:
- Amphenol ICC
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- RS Stock No.:
- 787-611
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 10075025-G01-20ULF
- ผู้ผลิต:
- Amphenol ICC
คุณสมบัติ / Specifications
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
รายละเอียดสินค้า / Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | Amphenol ICC | |
| Series | 10075025 | |
| Product Type | PCB Header | |
| Pitch | 2mm | |
| Number of Contacts | 20 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Connector System | Wire-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Termination Type | Through Hole | |
| Row Pitch | 2mm | |
| Contact Gender | Male | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand Amphenol ICC | ||
Series 10075025 | ||
Product Type PCB Header | ||
Pitch 2mm | ||
Number of Contacts 20 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Connector System Wire-to-Board | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Termination Type Through Hole | ||
Row Pitch 2mm | ||
Contact Gender Male | ||
- COO (Country of Origin):
- FR
The Amphenol Header is designed to ensure reliable connections in demanding environments. Its robust construction and precise engineering provide exceptional performance for various applications while maintaining durability and integrity.
Constructed for longevity, ensuring reliable performance over time
Designed to withstand harsh environmental conditions without compromising functionality
Features precise engineering for consistent and efficient connectivity
Optimised for enhanced signal integrity across diverse applications
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