Amphenol ICC 10075025 Series Straight Through Hole PCB Header, 20 Contact(s), 2 mm Pitch, 2 Row, Shrouded
- RS Stock No.:
- 787-611
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 10075025-G01-20ULF
- ผู้ผลิต:
- Amphenol ICC
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- RS Stock No.:
- 787-611
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 10075025-G01-20ULF
- ผู้ผลิต:
- Amphenol ICC
คุณสมบัติ / Specifications
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
รายละเอียดสินค้า / Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | Amphenol ICC | |
| Product Type | PCB Header | |
| Series | 10075025 | |
| Pitch | 2mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Copper | |
| Contact Plating | Gold | |
| Row Pitch | 2mm | |
| Termination Type | Through Hole | |
| Contact Gender | Male | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand Amphenol ICC | ||
Product Type PCB Header | ||
Series 10075025 | ||
Pitch 2mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Copper | ||
Contact Plating Gold | ||
Row Pitch 2mm | ||
Termination Type Through Hole | ||
Contact Gender Male | ||
- COO (Country of Origin):
- FR
The Amphenol Header is designed to ensure reliable connections in demanding environments. Its robust construction and precise engineering provide exceptional performance for various applications while maintaining durability and integrity.
Constructed for longevity, ensuring reliable performance over time
Designed to withstand harsh environmental conditions without compromising functionality
Features precise engineering for consistent and efficient connectivity
Optimised for enhanced signal integrity across diverse applications
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