Molex 70287 Series Vertical Through Hole Header, 6 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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RS Stock No.:
693-802
หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
70287-1001
ผู้ผลิต:
Molex
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เลือกทั้งหมด

Brand

Molex

Product Type

Header

Series

70287

Current

3A

Pitch

2.54mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

6

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

120°C

Tail Pin Length

3.18mm

Standards/Approvals

RoHS Compliant

Mating Pin Length

6.1mm

Voltage

250V

COO (Country of Origin):
MY
The Molex C-Grid PCB header is engineered for seamless board-to-board and wire-to-board connections within Compact makeshift environments. This dual-row header features a 2.54mm pitch and supports up to six circuits, ensuring a reliable and secure attachment in your electronic assemblies. With a robust current rating of 3.0A at a maximum voltage of 250V DC, this product is built to withstand demanding operational conditions. Its innovative design includes retention pins for added stability, making it Ideal for applications in consumer electronics and industrial systems. Crafted from high-temperature thermoplastic and plated with tin, this component combines durability with effective heat resistance, suited for use in various environmental settings.

Breakaway design allows for easy separation and custom length adjustments

Six circuits provide versatile connectivity options for your applications

Constructed from high-temperature thermoplastic for enhanced durability

Tin plating on the metal components ensures optimal conductivity

Mating Interface pitch of 2.54mm supports standardised electronic connections

Rated for a maximum voltage of 250V DC, suitable for high-performance use

Current capacity of 3.0A per contact enables reliable power transmission

Vertical orientation facilitates space-saving installations in dense layouts

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