Molex 78120 Series Vertical Surface Mount Receptacle, 10-Contact, 2 Row, 1.27 mm Pitch Surface Mount

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RS Stock No.:
693-421
หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
78120-1007
ผู้ผลิต:
Molex
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด

Brand

Molex

Number of Contacts

10

Product Type

Receptacle

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

1.27mm

Current

1.4A

Housing Material

Liquid Crystal Polymer

Termination Type

Surface Mount

Mount Type

Surface Mount

Orientation

Vertical

Connector System

Board-to-Board

Voltage

125V

Series

78120

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Contact Plating

Gold

Contact Material

Copper Alloy

Standards/Approvals

REACH SVHC

COO (Country of Origin):
SG
The Molex Slim-grid receptacle is expertly designed for seamless board-to-board connectivity, featuring 10 circuits for reliable signal transmission. Constructed from high-quality materials, it promises durability with a maximum rating of 1.4A per contact. Its thoughtful design encapsulates Advanced engineering, ensuring a Compact form factor with a vertical orientation, making it suitable for surface mount applications. The receptacle's gold plating provides excellent conductivity while retaining compliance with environmental standards, including EU RoHS. Ideal for various applications, the slim-grid receptacle meets the demands of modern electronic systems with a temperature operating range of -55° to +105°C, ensuring robust performance across a wide range of conditions.

10 circuit design allows for efficient space utilisation in Compact environments

Constructed from liquid crystal polymer, providing resistance against harsh operational conditions

Gold (Au) plating enhances connectivity and durability for long lasting performance

Durability rating of 500 mating cycles which ensuring consistent, reliable operation over time

Low-halogen status makes it suitable for environmentally-conscious manufacturing

Encourages high density packaging without compromising reliability or performance

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