Molex 90131 Series Vertical Through Hole PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

The Molex C-Grid III Header is expertly designed for efficient signal and wire-to-board applications, offering exceptional reliability in electronic connectivity. With a dual row, vertical layout accommodating up to 14 circuits, this header ensures seamless integration into PCB configurations. Its robust gold selective plating provides excellent conductivity, while the sturdy brass construction and high-temperature resin material guarantee durability in various operating conditions. Ideal for use in modern electronic devices, this header meets stringent compliance standards, ensuring product safety and environmental responsibility.

PCB thickness is optimally set at 1.60mm for compatibility across a variety of applications
Through-hole termination Interface facilitates easy installation on PCBs
Operates effectively within a wide temperature range of -55° to +125°C
Lead-free process capability reflects commitment to modern manufacturing standards
Supports multiple mating part configurations for flexible integration