RND RND 460 Series Thermal Gap Pad, 0.25mm Thick, 3W/m·K, Silicone, 100 x 103 x 5mm
- RS Stock No.:
- 492-067
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- RND 460-00114
- ผู้ผลิต:
- RND
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RS จะไม่สต็อกสินค้านี้อีกต่อไป
- RS Stock No.:
- 492-067
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- RND 460-00114
- ผู้ผลิต:
- RND
คุณสมบัติ / Specifications
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
รายละเอียดสินค้า / Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | RND | |
| Dimensions | 100 x 103 x 5mm | |
| Thickness | 0.25mm | |
| Length | 100mm | |
| Width | 100mm | |
| Thermal Conductivity | 3W/m·K | |
| Material | Silicone | |
| Series | RND 460 | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand RND | ||
Dimensions 100 x 103 x 5mm | ||
Thickness 0.25mm | ||
Length 100mm | ||
Width 100mm | ||
Thermal Conductivity 3W/m·K | ||
Material Silicone | ||
Series RND 460 | ||
The RND Thermal Gap Pad is designed to enhance heat transfer efficiency in demanding applications, providing a reliable solution for optimising thermal management. Comprising a silicone formulation, this pad is both environmentally friendly and inherently sticky, eliminating the need for adhesives that could compromise its performance. Its outstanding compressibility and flexibility allow it to conform to various surfaces, ensuring maximum contact and minimal thermal resistance. The pad operates effectively across a wide range of temperatures, from -50 to 200 degrees Celsius, making it suitable for various environmental conditions. With superior thermal conductivity and low thermal impedance, it is an essential component for applications requiring efficient heat dissipation.
Resistant to flames, providing added safety in high-temperature applications
Operates effectively at both high and low temperatures
Low thermal resistance at lower pressures optimises performance
Self-adhesive properties eliminate extra assembly materials
Operates effectively at both high and low temperatures
Low thermal resistance at lower pressures optimises performance
Self-adhesive properties eliminate extra assembly materials