OIS-170-1050-X-T EPIGAP OSA Photonics, OIS-170 1050nm IR LED, 0805 SMD package
- RS Stock No.:
- 173-6259
- หมายเลขชิ้นส่วนของผู้ผลิต:
- OIS-170-1050-X-T
- ผู้ผลิต:
- EPIGAP OSA Photonics
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- RS Stock No.:
- 173-6259
- หมายเลขชิ้นส่วนของผู้ผลิต:
- OIS-170-1050-X-T
- ผู้ผลิต:
- EPIGAP OSA Photonics
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Technical data sheets
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Product Details
ค้นหาผลิตภัณฑ์ที่คล้ายกันโดยเลือกคุณลักษณะอย่างน้อยหนึ่งรายการ
เลือกทั้งหมด | คุณลักษณะ | ค่า |
|---|---|---|
| Brand | EPIGAP OSA Photonics | |
| Peak Wavelength | 1050nm | |
| Package Type | 0805 | |
| Radiant Flux | 3.5 (Minimum)mW | |
| Radiant Intensity | 2mW/sr | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 1.9 x 1.2 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-170 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Maximum Supply Voltage | 1.5V | |
| เลือกทั้งหมด | ||
|---|---|---|
Brand EPIGAP OSA Photonics | ||
Peak Wavelength 1050nm | ||
Package Type 0805 | ||
Radiant Flux 3.5 (Minimum)mW | ||
Radiant Intensity 2mW/sr | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 1.9 x 1.2 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-170 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
Maximum Supply Voltage 1.5V | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 1.9mm x 1.2mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
package: 0805
size: 1.9mm x 1.2mm x 1.2mm
circuit substrate:glass laminated epoxy
lead free solderable, soldering pads: Gold plated
taped in 8 mm blister tape, cathod to transporting perforation
all devices sorted into luminous intensity classes
taping:face-up(T)
size: 1.9mm x 1.2mm x 1.2mm
circuit substrate:glass laminated epoxy
lead free solderable, soldering pads: Gold plated
taped in 8 mm blister tape, cathod to transporting perforation
all devices sorted into luminous intensity classes
taping:face-up(T)