- RS Stock No.:
- 182-2279
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 74221-101LF
- ผู้ผลิต / Manufacturer:
- Amphenol Communications Solutions
สินค้าหมดชั่วคราว (Temporarily out of stock) - จะเป็นแบ๊คออเดอร์จัดส่ง (back order for despatch) 02/10/2024, จัดส่งภายใน (delivery within) 4-6 วันทำการ (working days)
เพิ่ม / Added
ราคา / Price Each (On a Reel of 250)
THB1,009.403
(exc. VAT)
THB1,080.061
(inc. VAT)
Units | Per unit | Per Reel* |
250 - 250 | THB1,009.403 | THB252,350.75 |
500 - 750 | THB987.196 | THB246,799.00 |
1000 + | THB965.999 | THB241,499.75 |
*ตัวบ่งบอกราคา / price indicative |
ตัวเลือก
สินค้านี้ไม่มีจำหน่ายในขณะนี้ ลองดูสินค้าอื่นที่เราแนะนำ
- RS Stock No.:
- 182-2279
- หมายเลขชิ้นส่วนของผู้ผลิต / Mfr. Part No.:
- 74221-101LF
- ผู้ผลิต / Manufacturer:
- Amphenol Communications Solutions
ข้อมูลทางเทคนิค / Technical Data Sheets
Legislation and Compliance
- COO (Country of Origin):
- US
รายละเอียดสินค้า / Product Details
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
คุณสมบัติ / Specifications
คุณสมบัติ | Value |
---|---|
IC Socket Type | Prototyping Socket |
Package Type | BGA |
Gender | Female |
Number of Contacts | 400 |
Contact Material | Copper Alloy |
Contact Plating | Gold |
Current Rating | 450.0mA |
Socket Mounting Type | Surface Mount |
Device Mounting Type | Surface Mount |
Voltage Rating | 200.0 V |
Termination Method | Through Hole |
Housing Material | Liquid Crystal Polymer |